The Lam 810-234640-312 PCB Board is a high-quality printed circuit board (PCB) designed for use in industrial and electronic applications. It is used in a variety of systems that require reliable signal processing, data transfer, and power management. This PCB board is engineered for durability and precision, offering excellent performance in demanding environments. Its design is optimized for integration into complex systems, ensuring smooth operation and compatibility with other components. The Lam 810-234640-312 PCB is ideal for use in industries such as manufacturing, and electronics.
Product Status
Original New // Ready in Stock // Same Days Shipping▶Lam 810-234640-312 PCB Board Product Specifications
Material: FR4 (Flame Retardant 4)
Dimensions: Custom size based on application
Layers: Multi-layer design (e.g., 4-layer, 6-layer)
Copper Thickness: 1oz or 2oz (varies)
Surface Finish: HASL, ENIG, or other
Temperature Range: -40°C to +125°C
Impedance Control: Yes (for high-speed signals)
Mounting Type: Surface-mount or through-hole
Compliance: RoHS, UL certified
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▶Lam 810-234640-312 PCB Board Product Details
The Lam 810-234640-312 PCB Board is a high-quality, multi-layer printed circuit board designed to meet the needs of demanding industrial, and electronics applications. Constructed from durable FR4 material, this PCB is built for optimal performance and reliability in environments where precision and high durability are crucial.
With a multi-layer design, the 810-234640-312 is ideal for applications requiring a high component density and complex circuit routing. The board's layer count can vary depending on the specific needs of the application, typically offering configurations such as 4-layer or 6-layer designs for enhanced signal integrity and power distribution.
The board is designed to handle a wide temperature range of -40°C to +125°C, ensuring reliable operation even in extreme environmental conditions. This makes it particularly well-suited for industries like semiconductor manufacturing, industrial and electronics, where temperature fluctuations and harsh conditions are common.
In terms of electrical performance, the Lam 810-234640-312 PCB features impedance-controlled traces, which are critical for high-speed signal applications, ensuring minimal signal degradation and maintaining signal integrity. It supports high-frequency data transmission with precision, making it suitable for systems that require fast, reliable communication, such as communications equipment and control systems.
The board is equipped with both surface-mount and through-hole mounting options, providing flexibility in component integration and making it easy to incorporate into various types of assemblies. It also offers multiple surface finish options, including HASL (Hot Air Solder Leveling) and ENIG (Electroless Nickel Immersion Gold), to ensure excellent solderability and longevity.
▶Lam 810-234640-312 PCB Board FAQ
What is the primary application of the Lam 810-234640-312 PCB Board?
Answer: The Lam 810-234640-312 PCB Board is designed for high-performance applications in industries such as semiconductor manufacturing, industrial control systems, and electronics. It is used in systems that require high-density component integration, reliable signal processing, and durability under harsh conditions.
What material is the Lam 810-234640-312 PCB Board made from?
Answer: The Lam 810-234640-312 PCB is constructed from FR4 material, which is known for its excellent electrical insulation properties and durability. This makes it suitable for a wide range of industrial and electronic applications.
What are the key features of the Lam 810-234640-312 PCB Board?
Answer: The key features include:
Multi-layer design for high-density component integration
Impedance-controlled traces for high-speed signal integrity
Temperature range from -40°C to +125°C for use in harsh environments
Surface-mount and through-hole mounting options
RoHS compliance and UL certification
HASL and ENIG surface finishes for enhanced durability
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